RoHS指令新增豁免项目 New Exempted ITems of RoHS Directive
2008年5月24日，欧盟官方公报发布决议2008/385/EC，决议内容为，
RoHS指令新增豁免项目：
30. Cadmium alloys as electrical/mechanical solder joints to electrical conductors
located directly on the voice coil in transducers used in high-powered loudspeakers
with sound pressure levels of 100 dB (A) and more.
30. 用于位于音压级(SPL)大于或等于 100 分贝的大功率扬声器音圈上的电导体的电气/机
械焊点的镉合金。
31. Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting).
31. 用于无汞平板荧光灯（例如：用于液晶显示器、设计或工业照明）的焊料中的铅。
32. Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes.’
32. 用于氩和氪激光管防护窗组合件的封装玻璃料里的铅的氧化物。
自 RoHS 指令发布以来，欧盟委员会针对豁免材料陆续发布了 7 次决议，
分 别 是 ： 2005/717/EC 、 2005/747/EC 、 2006/310/EC 、 2006/690/EC 、2006/691/EC、2006/692/EC 和 2008/385/EC，这些决议中的豁免共计 32 项。
第 1 项至第 29 项豁免如下：
1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.
1. 小型荧光灯中的汞，汞含量不超过5mg/灯。
2 .Mercury in straight fluorescent lamps for general purposes not exceeding:
2. 普通用途直荧光灯中的汞，汞含量不超过：
• Halophosphate 10 mg;
盐磷酸盐 10mg.
• Triphosphate with normal lifetime 5 mg;
普通寿命的三磷酸盐5mg
• Triphosphate with long lifetime 8 mg.
长寿命的三磷酸盐8mg
3. Mercury in straight fluorescent lamps for special purposes.
3. 特殊用途直荧光灯中的汞
4 Mercury in other lamps not specifically mentioned in this Annex.
4. 本附录未明确提出的其他灯具中的汞
5 Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
5. 阴极射线管，电子元件以及荧光管的玻璃中的铅
6 Lead as an alloying element in:
6. 铅作为合金元素在：
• Steel containing up to 0.35 % lead by weight;
钢里，铅的重量含量不超过0.35 %
• Aluminium containing up to 0.4 % lead by weight;
铝里，铅的重量含量不超过0.4%
• Copper alloy containing up to 4 % lead by weight.
铜合金里，铅的重量含量不超过4%
7 • Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead).
7. 用于高温融化焊料中的铅（即：锡铅焊料合金中铅含量超过85%）
• Lead in solders for servers, storage and storage array systems, network
infrastructure equipment for switching, signalling, transmission as well as network management for telecommunication.
用于服务器，存储器和存储系统中的铅，用于交换，信号和传输，以及电信网络管理的网络基础设施设备中焊料中的铅。
• Lead in electronic ceramic parts (e.g. piezoelectronic devices).
电子陶瓷产品中的铅（如：高压电子装置）
8 .Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive
76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations.
8. 根据修改关于限制特定危险物质和与制品销售和使用的第76/796/EEC号指令的
91/338/EEC号指令禁止以外的镉电镀。
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.
在吸收式电冰箱中作为碳钢冷却系统防腐剂的六价铬。
9a DecaBDE in polymeric applications.
9a 应用于聚合物中的DecaBDE（十溴二苯醚）
[注：2008年4月初，欧洲法院（European Court of Justice）发布公告：欧盟委员会2005
年公布的针对十溴二苯醚的豁免项目存在程序性的错误，因此废除委员会决议2005/717/EC
附件第9a条对聚合物中十溴二苯醚的豁免，裁定将于2008年7月1日执行，因此聚合物中十 溴二苯醚的豁免只能延续至2008年6月30日。]
9b Lead in lead-bronze bearing shells and bushes.
9b 用于铅铜合金轴承和衬套中的铅。
11.Lead used in compliant pin connector systems.
11. 顺应针连接器系统中的铅。
12.Lead as a coating material for the thermal conduction module c-ring.
12. 用于热传导模块C-环的被覆材料中的铅。
13.Lead and cadmium in optical and filter glass.
13. 用于光学及滤波器玻璃中的铅和镉。
14.Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight.
14. 微处理器针脚及封装联接所使用的含两种以上组分的焊料中的铅（铅含量在80%85%
之间）。
15.Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
15. 集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
16. Lead in linear incandescent lamps with silicate coated tubes.
16. 用于带有硅酸盐灯管的线型白炽灯中的铅。
17. Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications.
17. 用在专业复印领域高强度放电灯(HID)做激发介质中的卤素铅。
18. Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as
BSP (BaSi2O5:Pb) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb).
18. 放电管的荧光粉中作为催化剂的铅（铅的重量小于等于1%）可以豁免，当放电管用于
含有磷元素（如BSP (BaSi2O5:Pb)）的日晒灯时，以及用于重氮印刷、平板印刷、捕虫、光化学、固化工艺等等专业领域的灯具时。
19. Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL).
19. 小型节能灯中作为主要汞合金的特定的PbBiSn-Hg 和PbInSn-Hg中的铅，以及作为辅助汞合金的PbSn-Hg中的铅。
20. Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD).
20. LCD的平板荧光灯前后基板键合时所用玻璃中的铅。
21. Lead and cadmium in printing inks for the application of enamels on
borosilicate glass.
21. 用在硅硼玻璃表面瓷釉上的印刷油墨中的铅和镉；
22. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems.
22. 在光纤通讯系统中的稀土铁石榴石法拉第旋转器中的杂质铅；
23. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead
23. 小螺距零部件表面处理中的铅（螺距不超过0.65mm且带镍铁边框的连接器，以及螺距 不超过0.65mm且带铜边框的连接器不在豁免之内）
24. Lead in solders for the soldering to machined through hole discoidal and planar
array ceramic multilayer capacitors.
24. 通过盘状及平面陈列陶瓷多层电容器的焊料所含的铅；
25. Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes.
25. 等离子显示屏（PDP）及表面传导式电子发射显示器（SED）构件中所用的氧化铅，特
别是在玻璃前后绝缘层中所用的氧化铅、总线电极中的氧化铅、黑条（彩色显像管）中的氧 化铅、地址电极中的氧化铅、阻挡层肋柱的氧化铅、密封玻璃料中的氧化铅，以及封装玻璃 中的氧化铅、环状玻璃中的氧化铅、印墨中的氧化铅；
26. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.
26. 黑蓝灯（BLB）玻璃封装中的氧化铅；
27. Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.
27. 用作大功率扬声器（用在长时间操作125分贝以上的音响系统）的传感器中焊料的铅合 金。
28. Hexavalent chromium in corrosion preventive coatings of unpainted metal
sheetings and fasteners used for corrosion protection and Electromagnetic
Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment).Exemption granted until 1 July 2007.
28. 用于防腐或屏蔽电磁干扰，用在特定仪器设备中（欧盟指令2002/96/EC第三类规定的
IT和通讯设备）的金属片或金属扣件上的防腐涂层中的六价铬。这项豁免将于2007年7月1 日停止。
29. Lead bound in crystal glass as defined in Annex I (Categories1, 2, 3 and 4) of
Council Directive 69/493/EEC (*).
29. 水晶玻璃中铅含量的限定依照欧盟指令69/493/EEC附件Ⅰ(第1、2、3、4类)。
注: 以上豁免项目，若中文译文与英文原文意思上不一致, 以英文原文为准
Remark: If the Chinese translation contradicts the English text, the English text will prevail
